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January 4, 2023
Akoustis Completes Qualification of Wafer-Level-Packaging
Akoustis Completes Qualification of Wafer-Level-Packaging
Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.
Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/39411-akoustis-completes-qualification-of-wafer-level-packaging
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