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DAS Micro CellSivers Wireless Receives Second-Round of Prototype Orders from Tier-1 5G Infrastructure Vendor
Sivers Wireless Receives Second-Round of Prototype Orders from Tier-1 5G Infrastructure Vendor
Sivers Semiconductors received another order in the lower thousands of units from its Tier-1 5G infrastructure customer for beamformer and up-/down-converter chips that will be used in the next product prototype build by the customer.
Sivers Semiconductors received another order in the lower thousands of units from its Tier-1 5G infrastructure customer for beamformer and up-/down-converter chips that will be used in the next product prototype build by the customer.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/40718-sivers-wireless-receives-second-round-of-prototype-orders-from-tier-1-5g-infrastructure-vendor
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