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November 22, 2022
StratEdge Glass Side Wall Packages: Straightforward Packaging Solutions
StratEdge Glass Side Wall Packages: Straightforward Packaging Solutions
StratEdge Corporation announced that its off-the-shelf line of glass side wall packages, called molded ceramic packages, can be configured to meet the requirements for chips with frequencies up to 18 GHz.
StratEdge Corporation announced that its off-the-shelf line of glass side wall packages, called molded ceramic packages, can be configured to meet the requirements for chips with frequencies up to 18 GHz.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/39234-stratedge-glass-side-wall-packages-straightforward-packaging-solutions
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