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DAS Micro CellMPI Corporation Installs its WaferWallet®MAX for 200/300 mm WLR Processes
MPI Corporation Installs its WaferWallet®MAX for 200/300 mm WLR Processes
MPI Corporation’s Advanced Semiconductor Test Division initiated the integration of the TS3500-SE automated wafer probe test system with WaferWallet®MAX, a multi-purpose cassette, FOUP self-docking 200 and 300 mm handling solution, into a leading WLR test process.
MPI Corporation’s Advanced Semiconductor Test Division initiated the integration of the TS3500-SE automated wafer probe test system with WaferWallet®MAX, a multi-purpose cassette, FOUP self-docking 200 and 300 mm handling solution, into a leading WLR test process.
http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/38632-mpi-corporation-installs-its-waferwalletmax-for-200-300-mm-wlr-processes
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