March 16, 2022

Teledyne Labtech Announces New Advanced Graphite Embedding Capability for PCB Thermal Management

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Teledyne Labtech Announces New Advanced Graphite Embedding Capability for PCB Thermal Management

Teledyne Labtech announced a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards.

Teledyne Labtech announced a major new capability allowing the embedding of layers of synthetic graphite within RF and microwave printed circuit boards.

http://www.microwavejournal.com/rss/topic/3369-industry-newsIndustry Newshttps://www.microwavejournal.com/articles/37855-teledyne-labtech-announces-new-advanced-graphite-embedding-capability-for-pcb-thermal-management

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