A joint test conducted by researchers of the U.S. Air Force Research Laboratory, Oak Ridge National Laboratory, Ball Aerospace & Technologies Corporation, Brigham Young University, U.S. Army RDECOM-ARDEC and Sciperio, used two types of 3D printing technology to compare the mechanical and thermal resilience of different materials for printing electronics for harsh conditions.

A joint test conducted by researchers of the U.S. Air Force Research Laboratory, Oak Ridge National Laboratory, Ball Aerospace & Technologies Corporation, Brigham Young University, U.S. Army RDECOM-ARDEC and Sciperio, used two types of 3D printing technology to compare the mechanical and thermal resilience of different materials for printing electronics for harsh conditions.